M36 | Device Type | M36 = MultiChip package (Multiple Flash + RAM) |
X | Flash 1 Architecture | A = Single bank, Boot blockL = Multi-Level, Multiple bank, Burst modeW = Multiple Bank, Burst ModeC = Single bank, Boot blockP = Multi-level, multi bank, large buffer |
X | Flash 2 Architecture | 0No dieL = Multi-Level, Multiple bank, Burst mode |
X | Operating Voltage | R = Vddf=Vccp=Vddq=1.7 to 1.95VT = Vddf=1.7 to 2V, Vddq=Vddp=2.7 to 3.3VW = Vddf=Vccp=2.7V to 3.3V |
X | Flash 1 Density | 5 = 32Mbit6 = 64Mbit7 = 128Mbit8 = 256Mbit9 = 512Mbit |
X | Flash 2 Density | 0No die7 = 128Mbit8 = 256Mbit |
X | RAM 1 Density | 2 = 4Mbit3 = 8Mbit4 = 16Mbit5 = 32Mbit6 = 64Mbit |
X | RAM 0 Density | 0No die |
X | Parameter Blocks Location | T, U = Top boot block flashB, L = Bottom boot block flashD = Mixed (Flash 1 bottom, Flash 2 top)M = Mixed (Flash 1 top, Flash 2 bottom)N = Even block flash memory configuration, Mux I/OE = Even block flash memory configuration |
X | Product Version | Blank00.13um Flash technology, 70ns speed00.13um Flash technology, 70ns; 0.18um RAM, 85ns speed00.13um Flash technology, 70ns; 0.13um RAM, 70ns speed00.13um Flash technology, 70ns; 0.15um RAM, 70ns speed00.18um technology PSRAM, 60ns speed090nm flash technology, 96ns speed, 0.11um PSRAM, 70ns speed090nm flash technology, 96ns speed, 0.11um PSRAM, 80ns speed1 = 0.13um Flash technology, 85ns speed; 0.11um PSRAM,70ns speed, burst mode1 = 90nm Flash technology, 70ns; 0.13um RAM, 70ns speed2 = 90nm Flash technology Multilevel Design, 85ns speed;0.13um RAM, 65ns speed3 = 90nm Flash technology, 70ns speed, RAM, Mux I/O4 = 65 nm flash technology, 70ns speed, RAM, 70ns speed, mux I/O5 = 65nm flash technology, 70ns speed, exteded OTP,RAM technology: 70ns, mux I/O8 = 90nm Flash technology Multilevel Design, 85ns speed;0.11um PSRAM, 70ns speed, burst mode9 = 65 nm flash technology multilevel design, 70 and 85 ns speed;0.11 µm PSRAM, 70 ns speed, burst mode |
XXX | Package Type | ZAQ = Stacked TFBGA88/LFBGA88, 8x10mm active ball array, 0.8mm pitchZAI = Stacked LFBGA66, 12x8mm - 8x8 active ball array, 0.8mm pitchZAC, ZAN = Stacked TFBGA107, C stacked footprintZAM = Stacked TFBGA88, 8x10mm, 8x10 active ball array, 0.8mm pitchZSP = Stacked TFBGA56, 7x9mm, 56 ball array, 0.8mm pitchZS = Stacked TFBGA56, 8x6mm, 10x6 active ball array, 0.50mm pitch |
X | Option | Blank = Standard packingT = Tape&Reel packingE = Lead-free and RoHS standard packingF = Lead-free and RoHS Tape&Reel packing |